LSO 3000G Laser Depaneling & Marking Machine

LSO 3000G Laser Depaneling & Marking Machine

LSO 3000G Laser Depaneling & Marking Machine

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Laser Depaneling & Marking Machine

Semi-Automatic LSO 3000G
LSO 3000G PCB雷射切割&打標設備 LSO 3000G PCB雷射切割&打標設備
LSO 3000G PCB雷射切割&打標設備
LSO 3000G PCB雷射切割&打標設備
產品資訊
規格
產品資訊

Dust Free˙Non-Contact Cutting

Laser Depaneling  & Marking Machine

◆ Accuracy ± 25 μm (1 Mil)
◆ Axes Driving speed up to 1000mm/sec
◆ Laser marking & depaneling All-in-One
◆ Configurable Laser Source per demand
◆ Apply to Flexible, Rigid, Flex-rigid PCB

規格
項目
規格
Laser class
4
Accuracy
± 25 μm (1 Mil)
Spot Size
20um
Laser Source (Configure per your demand)
10W Green laser (cutting thickness ≤0.6mm)
Laser Source (Configure per your demand)
20W Green laser (cutting thickness ≤1.5mm)
Laser Source (Configure per your demand)
12W UV laser (cutting thickness ≤1mm)
Laser Source (Configure per your demand)
20W UV laser laser (cutting thickness ≤2mm)
Loading & Unloading
Manual
Processing Table
2
Processing Table Size
380mm x 380mm
Operation Side
Front
Whole cutting area
350mm x 350mm
Single cutting area
50mm x 50mm
Applicable Panel thickness
Depending on laser source
Working temperature
23°C±2°C
Humidity
<70% (non-condensing)
Particle Extraction
filter
AXES
X, Y1, Y2, Z
Motors
AC brushless servo motors
Axis Speed
250mm/s
Power Supply
220V 3P+PE-50/60Hz, ±3%
Power Consumption
Depending on laser source
Air Pressure
0.6 MPa
Average Consumption
<10NI/min
Length x Width x Height
1400mm x 1400mm x 1500mm
Weight
Approx. 1000 Kg
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