LSO 3000G Laser Depaneling & Marking Machine

LSO 3000G Laser Depaneling & Marking Machine

從自動化關鍵零組件的單軸模組,傳動元件,運動控制卡,軟體研發,到自動化設備應用規劃及研發客制,如產業機器人,機器手臂,PCB切割機,SMT制程設備,LED/半導體制程設備,光通訊設備,自動光學檢測AOI設備和椿科技提供一貫且完整的解決方案。

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Laser Depaneling  & Marking Machine

Semi-Automatic LSO 3000G
LSO 3000G PCB雷射切割&打標設備 LSO 3000G PCB雷射切割&打標設備
LSO 3000G PCB雷射切割&打標設備
LSO 3000G PCB雷射切割&打標設備
Product
Specification
Product

Dust Free˙Non-Contact Cutting

Laser Depaneling  & Marking Machine

◆ Accuracy ± 25 μm (1 Mil)
◆ Axes Driving speed up to 1000mm/sec
◆ Laser marking & depaneling All-in-One
◆ Configurable Laser Source per demand
◆ Apply to Flexible, Rigid, Flex-rigid PCB

Specification
Project
Specification
Laser class
4
Accuracy
± 25 μm (1 Mil)
Spot Size
20um
Laser Source (Configure per your demand)
10W Green laser (cutting thickness ≤0.6mm)
Laser Source (Configure per your demand)
20W Green laser (cutting thickness ≤1.5mm)
Laser Source (Configure per your demand)
12W UV laser (cutting thickness ≤1mm)
Laser Source (Configure per your demand)
20W UV laser laser (cutting thickness ≤2mm)
Loading & Unloading
Manual
Processing Table
2
Processing Table Size
380mm x 380mm
Operation Side
Front
Whole cutting area
350mm x 350mm
Single cutting area
50mm x 50mm
Applicable Panel thickness
Depending on laser source
Working temperature
23°C±2°C
Humidity
<70% (non-condensing)
Particle Extraction
filter
AXES
X, Y1, Y2, Z
Motors
AC brushless servo motors
Axis Speed
250mm/s
Power Supply
220V 3P+PE-50/60Hz, ±3%
Power Consumption
Depending on laser source
Air Pressure
0.6 MPa
Average Consumption
<10NI/min
Length x Width x Height
1400mm x 1400mm x 1500mm
Weight
Approx. 1000 Kg