Nano-Patterned Sapphire Substrate, NPSS

從自動化關鍵零組件的單軸模組,傳動元件,運動控制卡,軟體研發,到自動化設備應用規劃及研發客制，如產業機器人,機器手臂,PCB切割機,SMT制程設備,LED/半導體制程設備,光通訊設備,自動光學檢測AOI設備和椿科技提供一貫且完整的解決方案。

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Aurotek Corporation provides this Web site to you, subject to these Terms of Use. The Terms of Use may be updated by Aurotek from time to time without notice to you. This Web site and other Aurotek Web sites that are linked to this site or affiliated with this site (collectively "the Site") and all the information, communications, software, scripting, photos, text, video, graphics, music, sounds, images and other materials and services found on the Site (collectively "Content"), is intended for the lawful use of Aurotek's customers, employees and members of the general public. The Site is controlled and operated in whole or in part by Aurotek from its offices within the Republic of China (Taiwan). Aurotek makes no representation that these materials are appropriate or available for use in locations other than Taiwan. Those who access the Site from other locations do so at their own risk and are responsible for compliance with applicable local laws. You acknowledge that Aurotek reserves the right in its sole discretion to refuse or terminate access to the Site by you at any time.

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Project	Specification
Orientation	Surface Orientation : C-plain (0001) Orientation Flat : A-plane (11-20)
Wafer Size	Diameter : 50.8 +/- 0.2 mm Thickness : 430 +/- 25 mm
Front Surface(Pattern Size)	Pitch: 1000nm Height: 600nm Bottom Diameter: 900nm Arrangement : Trigonal
Back Surface	Finishing : Fine Ground

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Nano-Patterned Sapphire Substrate, NPSS

Nano-Patterned Sapphire

Product

Specification

Product

The periodic sapphire nano-structure is fabricated by etching technology, carriers for gallium nitride glowing and world wide material for high brightness blue light emitting diode.

Advantages of nano patterned sapphire substrate (NPSS):

Enhance the light extraction of LED.
Improve the electrical performance of LED.

Advantages of NPSS than PSS：

High uniformity of sub-micro structure patterned by nano-imprinting.
Increase throughput of dry etching and epitaxy equipment.

Specification

Project

Specification

Orientation

Surface Orientation : C-plain (0001)
Orientation Flat : A-plane (11-20)

Wafer Size

Diameter : 50.8 +/- 0.2 mm
Thickness : 430 +/- 25 mm

Front Surface(Pattern Size)

Pitch: 1000nm
Height: 600nm
Bottom Diameter: 900nm
Arrangement : Trigonal

Back Surface

Finishing : Fine Ground

Nano-Patterned Sapphire Substrate, NPSS