NEPCON JAPAN 2017 – 46th Electronics R&D and Manufacturing Technology Expo 2017/1/18-1/20

Dates: January 18 [Wed] - 20 [Fri], 2017
Venue: Tokyo Big Sight, Tokyo, JAPAN
(Transportation)
Booth No.: E13-32
Exhibiting Ticket Request (Free):
https://contact.reedexpo.co.jp/expo/NWJ/?lg=en&tp=ex&ec=NWJ

46th NEPCON JAPAN is the world's leading trade show for electronics manufacturing and R&D. Many innovations in the electronics industry happened there every year. NEPCON JAPAN is comprised of 6 exhibitions & conference specialised in the following fields: SMT, IC Packaing, PCB/PWB, Testing/Measurement, Component/Materials, Fine Process.

Held within NEPCON JAPAN 2017 – 46th Electronics R&D and Manufacturing Technology Expo

46th INTERNEPCON JAPAN
34th ELECTROTEST JAPAN
18th IC PACKAGING TECHNOLOGY EXPO
18th ELECTRONIC COMPONENTS & MATERIALS EXPO
PWB EXPO–18th Printed Wiring Boards Expo
7th FINE PROCESS TECHNOLOGY EXPO

Exhibit Profile

INTERNEPCON JAPAN
ASIA'S LARGEST Exhibition featuring all kinds of Equipment, Materials and Technologies for Electronics Manufacturing and SMT

ELECTROTEST JAPAN
Exhibition featuring all kinds of Test, Inspection and Measurement Systems for SMT, IC Packaging and Board Manufacturing

IC PACKAGING TECHNOLOGY EXPO
Specialised in Packaging Technologies for Semiconductors, LED, MEMS, Sensors

ELECTRONIC COMPONENTS & MATERIALS EXPO
Electronic Components/Devices and Materials for Household Electronic Appliances and Industrial Instrument

PWB EXPO–Printed Wiring Boards Expo
Exhibition featuring PCBs/PWBs, PCB Materials, Design & Development Services, Design Tools

FINE PROCESS TECHNOLOGY EXPO
Exhibition specialised in all kinds of Processing Technologies for Electronics Manufacturing


2017/01/16 10:23
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