Laser Remove Underfill Machine

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LS2-C1-200RS Automatic remove underfill glue system

- Applicable variety of plastic materials, laser remove underfill glue
- 1064nm, 532nm wavelength laser option
- Supports autofocus function
- Comply with CE stander

LS2-C1-200RS Automatic remove underfill glue system

  • - Scanning area> 100 mm X 100 mm
  • - 1064nm, 532nm wavelength laser option
  • - CCD positioning accuracy < 5um
  • - Remove underfill glue laser line width < 50um